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| Datasheet File OCR Text: |
| ZMD-Standard November 1995 Package SOP24 (300 mil) MDS 739 Supersedes Mae in mm Based on IEC 191-2Q: Type 075E05 B 1 Dimensions X A2 A View X k x 45 0,1 24 LP A1 1 Z e D b 0,2 M Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2,65 0,35 0,49 1,27 10,00 10,65 0,40 0,82 HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* 2,45 0,10 0,30 2,25 2,45 0,23 0,32 15,20 15,60 7,40 7,60 0,25 0 8 * without mold-flash 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,7 g Low stress epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends Emin* Emax* kmin min max Zentrum Mikroelektronik Dresden GmbH Editor: signed Schoder Check: signed Wilde Date: 13.11.1995 Quality: signed Lorenz Doc-No. QS-000739-HD-02 Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten. Proprietary data, company confidential. All rights reserved. c |
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